Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
Sep 4, 2014
filing date -
May 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided are an apparatus and method of packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and on which packaging areas are defined along the extending direction thereof. The flexible substrate is transferred through a packaging module. An empty area, on which a semiconductor device is not mounted, is detected by a camera from among the packaging areas. Heat dissipation paint composition is applied on at least one semiconductor device located in a processing region of the packaging module by a screen printing process. Thus, a heat dissipation layer configured to package the semiconductor device is formed. Here, operations of the packaging module are controlled by a control unit so that the packaging process is omitted with respect to the empty area.
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