Method of Packaging Semiconductor Devices and Apparatus for Performing the Same
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United States of America Patent
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Issued Date -
Nov 12, 2015
app pub date -
Sep 25, 2014
filing date -
May 9, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a method of packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and including packaging areas arranged along the extending direction thereof. An empty area, on which a semiconductor device is not mounted, is detected from among the packaging areas. When the empty area is detected, a heat dissipation paint composition is applied on the semiconductor devices mounted on the remaining packaging areas except for the empty area to form first heat dissipation layers. When the empty is not detected, the heat dissipation paint composition is applied on the semiconductor devices mounted on the packaging areas to form second heat dissipation layers. Here, the first dissipation layers are formed by a potting process, and the second heat dissipation layers are formed by a screen printing process.
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