PRESSURE-SENSITIVE ADHESIVE COMPOSITION
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United States of America Patent
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Nov 19, 2015
app pub date -
Sep 24, 2014
filing date -
Sep 24, 2013
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Abstract
The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
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