SUPPORT PLATE AND METHOD FOR FORMING SUPPORT PLATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
May 15, 2015
filing date -
May 16, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A support plate to which a front surface of a wafer having a device region in which plural devices are formed and a peripheral surplus region surrounding the device region on the front surface is stuck. The support plate includes a base plate in which a recess is formed in a front surface region corresponding to the device region of the wafer to be stuck to the support plate and an annular groove is formed in a region corresponding to the peripheral surplus region of the wafer, and a soft member packed in the recess of the base plate. The wafer is stuck to a front surface of the support plate with the intermediary of an adhesive by injecting the adhesive into the annular groove.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully