Semiconductor devices and methods for backside photo alignment

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United States of America Patent

PATENT NO 9299663
SERIAL NO

14281362

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Abstract

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Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Yang Boise, US 21 98
Dowdle, Kevin M Pocatello, US 2 20
Gambee, Christopher J Caldwell, US 24 94
Gandhi, Jaspreet S Boise, US 75 546
Hacker, Jon Meridian, US 2 20
Vasilyeva, Irina Boise, US 20 419
Wirz, Brandon P Kuna, US 52 86
Ypma, Keith Boise, US 3 21

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