Method of forming solder bump, and solder bump

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United States of America Patent

PATENT NO 10090268
APP PUB NO 20150333027A1
SERIAL NO

14809533

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.

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Patent Owner(s)

  • MURATA MANUFACTURING CO., LTD.; SENJU METAL INDUSTRY CO., LTD

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurushima, Tohru Tokyo, JP 1 3
Nishimura, Shigeo Nagaokakyo, JP 5 33
Sekimoto, Yasuyuki Nagaokakyo, JP 7 27
Takaoka, Hidekiyo Nagaokakyo, JP 42 320
Ueshima, Minoru Matsudo, JP 40 299

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