Semiconductor device including filling material provided in space defined by three semiconductor chips
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United States of America Patent
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Sep 13, 2016
Issued Date -
N/A
app pub date -
May 7, 2015
filing date -
May 12, 2014
priority date (Note) -
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Abstract
A semiconductor device comprises a wiring substrate, first and second semiconductor chips mounted on the wiring substrate so as to be spaced apart from each other, a third semiconductor chip mounted on the first and second semiconductor chips, first and second adhesive layers that are provided between the first and second semiconductor chips and the wiring substrate so as to bond the first and second semiconductor chips to the wiring substrate, and a third adhesive layer that is provided between the third semiconductor chip and the first and second semiconductor chips so as to bond the third semiconductor chip to the first and second semiconductor chips, with its thickness being made thicker than that of the first and second adhesive layers, a sealing layer covering the wiring substrate, and a filling layer that is provided between the first and second semiconductor chips and is different from the sealing layer.
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