Holding of interposers and other microelectronic workpieces in position during assembly and other processing
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United States of America Patent
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Dec 20, 2016
Grant Date -
Nov 19, 2015
app pub date -
Nov 6, 2014
filing date -
May 13, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A workpiece (120) has protruding conductive features (140) at least on a first side. The second side is processed while the workpiece is held from the first side by a holder (220H). To prevent damage to the protruding features and flatten the workpiece (which could be otherwise warped), a spacer (210) is inserted between the workpiece and the holder. The spacer has holes (250) receiving the protruding features. The workpiece can be held by forces generated by the holder such as vacuum or an electrostatic force, without an adhesive. Other features and advantages are provided.
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