Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
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United States of America Patent
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Apr 4, 2017
Issued Date -
N/A
app pub date -
Jul 27, 2015
filing date -
Dec 20, 2012
priority date (Note) -
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Abstract
A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.
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