Importance

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Abstract

A multilayer printed circuit board comprising conductive layers separated by dielectric insulation layers, at least one conductive layer being patterned and parts of conducting layers being interconnected by means of vias traversing insulation layers, and at least one component having terminals electrically connected with conducting layers is countersunk at least partly in a cavity having a floor and side walls, whereby a first component is completely countersunk in the cavity with its terminals connected face-down directly with contacts on the floor of the cavity and at least one further component is stacked above the first component, whereby an edge of the lower surface of the second component projecting over the upper surface area of the at least one further component is provided with terminals being connected directly face-down with contacts of the circuit board arranged on a level higher than the floor of the cavity.

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First Claim