METHOD FOR PRODUCING LAYERED POLISHING PADS

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United States of America Patent

APP PUB NO 20150336234A1
SERIAL NO

14652774

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method for producing a layered circular polishing pad, comprising steps of forming, in a circular polishing sheet, concentric grooves and an outer circumferential region having a width of ½ or more of a groove pitch of the concentric grooves; and bonding the circular polishing sheet and a supporting layer to each other with a bonding member interposed therebetween to produce a layered polishing sheet. According to the present invention, it is possible to provide a method for producing a layered circular polishing pad in which the polishing layer and the supporting layer are not easily peeled from each other.

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Patent Owner(s)

Patent OwnerAddress
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIMURA, Tsuyoshi Osaka, JP 75 789

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