CIRCULAR POLISHING PAD
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Dec 4, 2013
filing date -
Dec 28, 2012
priority date (Note) -
Abandoned
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Abstract
A circular polishing pad includes a circular polishing layer having XY grid grooves on a polishing surface. The center point of the circular polishing layer is offset in a region (Z) (including imaginary straight lines) enclosed by three imaginary straight lines (A, B, and C) each shifted by a groove pitch of 5% in relation to reference lines defined by an X groove or a Y groove. The circular polishing pad can minimize polishing unevenness on the surface of a material to be polished.
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