LOW MODULUS NEGATIVE TONE, AQUEOUS DEVELOPABLE PHOTORESIST
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United States of America Patent
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Dec 3, 2015
app pub date -
Nov 20, 2013
filing date -
Nov 20, 2012
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Abstract
Hydrophobic, low modulus, photoimagable, functionalized polyimides have been discovered that can be developed using aqueous solutions. In particular, compositions containing the functionalized polyimides of the current invention can be used in the photolithography step for the passivation layer on a silicon wafer to reduce stress in thin wafers, or as a low modulus hydrophobic solder mask. These materials can serve as protective layers in other applications in which a thin, flexible, and hydrophobic polymer is required.
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