AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Dec 11, 2013
filing date -
Dec 25, 2012
priority date (Note) -
Abandoned
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Abstract
A chemical mechanical polishing aqueous dispersion includes colloidal silica (A), an anionic water-soluble polymer (B), and at least one type of an alkanolamine salt (C) selected from the group consisting of an alkyl sulfate and an alkyl ether sulfate, the chemical mechanical polishing aqueous dispersion having a pH of 1 to 4.
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