Method of Temporarily Attaching a Rigid Carrier to a Substrate
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United States of America Patent
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Issued Date -
Dec 3, 2015
app pub date -
Mar 23, 2015
filing date -
Jul 5, 2006
priority date (Note) -
Abandoned
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Abstract
Method for temporarily attaching a substrates to a rigid carrier is described which includes forming a sacrificial layer of a thermally-decomposable polymer, e.g., poly(alkylene carbonate), and bonding the flexible substrate to the rigid carrier with the sacrificial layer positioned therebetween. Electronic components and/or circuits may then be fabricated or other semiconductor processing steps employed (e.g., backgrinding) on the attached substrate. Once fabrication is completed, the substrate may be detached from the rigid carrier by heating the assembly to decompose the sacrificial layer.
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