Drawing Die With Lower Die Provided With Microstructures
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United States of America Patent
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N/A
Issued Date -
Dec 10, 2015
app pub date -
Aug 29, 2014
filing date -
Jun 6, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A drawing die with a lower die provided with microstructures is provided, including a lower die. The lower die is secured on a lower die holder, coordinates with a blank pressing plate to clamp a board and performs drawing processing on the board by using a punch moving relative to the lower die, where a top working surface, a shoulder surface, and a die cavity side wall surface of the lower die include multiple microstructures sunken into the surfaces, or a surface, which touches the board when drawing is performed, of the lower die includes multiple microstructures sunken into the surface.
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Cited Art Landscape
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