HIGH-THROUGHPUT MANUFACTURING OF MICRONEEDLES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 10, 2015
app pub date -
Jan 17, 2014
filing date -
Jan 18, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a system for fabricating a microneedle device and microneedle devices. The system includes depositing a first material on a delivery sheet, introducing the delivery sheet with deposited first material to a mold, passing the delivery sheet with deposited first material and mold through a nip-point to introduce at least a portion of first material into cavities in the mold, and separating the mold from the first material to provide a microneedle device with needles mimicking the cavities of the mold.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully