METHOD FOR MANUFACTURING ELECTROCONDUCTIVE ADHESIVE COMPOSITION FOR ELECTROCHEMICAL DEVICE ELETRODE

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United States of America Patent

APP PUB NO 20150353780A1
SERIAL NO

14761891

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Abstract

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Provided is a method for manufacturing an electroconductive adhesive composition for an electrochemical device electrode, the method including: a first step of stirring a slurry containing an electroconductive carbon, a particulate binder and a dispersion medium at a temperature range of 5 to 40° C.; and a second step of treating the slurry stirred in the first step by using a high pressure disperser with a treatment pressure of 80 to 230 MPa and a nozzle diameter of 100 to 500 μm.

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Patent Owner(s)

Patent OwnerAddress
ZEON CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
YOSHIDA, Naoki Tokyo, JP 175 2176

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