Transponder Layer and Method for Producing Same
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United States of America Patent
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Issued Date -
Dec 10, 2015
app pub date -
Jul 12, 2013
filing date -
Jul 13, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a transponder layer (30), in particular for producing a laminate structure, for example being embodied as a chip card, having an antenna substrate (31), which, on an antenna side (38), is equipped with an antenna (33) formed from a wire conductor (32) as well as with a chip (41), and which, on the antenna side, has terminal conductors for connecting the chip to the wire conductor of the antenna, in such a manner that the chip is arranged adjacently to terminal ends (34, 35) of the wire conductor, and in such a manner that both the terminal ends of the wire conductor and chip terminals (39, 40), which are arranged on a contact side of a semiconductor body of the chip, said contact side facing towards the antenna substrate, are contacted with the terminal conductors. Furthermore, the invention relates to a laminate inlay for a laminate structure that is formed from multiple laminate layers, having such a transponder layer, to a chip card having such a laminate inlay, and to a method for producing such a transponder layer.
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