SUBSTRATE FOR ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Dec 10, 2015
app pub date -
Jun 4, 2015
filing date -
Jun 6, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A base substrate includes a first layer which is a ceramic layer; a second layer which is disposed on one surface side of the first layer, and contains at least one of a glass layer, a silicon layer, and a quartz layer; and a concave portion that is opened on a side of the second layer opposite to the first layer. In addition, the concave portion is formed through etching.
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