CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 10, 2015
app pub date -
Jun 5, 2015
filing date -
Jun 6, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit substrate includes an insulating layer, a conductor layer laminated on the insulating layer and including a plane layer portion, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer. The plane layer portion of the conductor layer has recess portions or opening portions, and the solder resist layer includes recessed portions covering the recess portions or opening portions of the plane layer portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully