Low-E Panels Utilizing High-Entropy Alloys and Combinatorial Methods and Systems for Developing the Same
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 12, 2014
filing date -
Jun 12, 2014
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Abandoned
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Abstract
Embodiments provided herein describe low-e panels utilizing high-entropy alloys (HEAs) and methods for forming such low-e panels, as well as combinatorial methods and systems for developing such low-e panels. A transparent substrate is provided. A reflective layer is formed above the transparent substrate. A metallic layer is formed above the transparent substrate. The metallic layer includes an HEA. The metallic layer, or any other component of the low-panels, may be formed using combinatorial processing.
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