CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND PILLAR-SHAPED TERMINAL FOR CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 16, 2015
filing date -
Jun 17, 2014
priority date (Note) -
Abandoned
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Abstract
A circuit board according to the present invention includes a first substrate that is or is to be connected to a second substrate. Electrodes are arranged on a principal surface of the first substrate, and pillar-shaped terminals are bonded to the respective electrodes with solder portions provided therebetween. Each pillar-shaped terminal includes a pillar-shaped terminal body and a solder blocking layer that covers a central region of an outer peripheral surface of the pillar-shaped terminal body in a height direction, and the pillar-shaped terminal has a shape that is vertically symmetrical about the solder blocking layer. The area of a region of the outer peripheral surface of the pillar-shaped terminal body that is not covered with the solder blocking layer is larger than the area of the region of the outer peripheral surface that is covered with the solder blocking layer.
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