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United States of America Patent

PATENT NO 9293444
APP PUB NO 20150364450A1
SERIAL NO

14837576

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Abstract

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A microelectronic package has a dielectric element with first and second parallel apertures. A first microelectronic element has contacts overlying the first aperture, and a second microelectronic element has contacts overlying the second aperture. The second microelectronic element can overlie a rear face of the first microelectronic element and the same surface of the dielectric element as the first microelectronic element. First terminals on a second surface of the dielectric element between said first and second apertures can be configured to carry all data signals for read and write access to memory locations within the first and second microelectronic elements.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crisp, Richard Dewitt Hornitos, US 113 2738
Haba, Belgacem Saratoga, US 718 20815
Zohni, Wael San Jose, US 152 2939

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