WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 16, 2015
filing date -
Jun 17, 2014
priority date (Note) -
Abandoned
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Abstract
A wiring substrate includes a first substrate to be connected to a second substrate. Electrodes are disposed on a substrate main surface of the first substrate, and columnar terminals are bonded onto the electrodes via solder portions. Each columnar terminal includes a columnar terminal body, and a projecting piece that projects from an outer peripheral surface of the columnar terminal body at a center portion, in a height direction, of the outer peripheral surface of the columnar terminal body. Each columnar terminal has a shape vertically symmetrical about the projecting piece.
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