ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS
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United States of America Patent
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Issued Date -
Dec 17, 2015
app pub date -
Jun 12, 2015
filing date -
Jun 13, 2014
priority date (Note) -
Abandoned
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Abstract
An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component.
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