PREDICTING CIRCUIT RELIABILITY AND YIELD USING NEURAL NETWORKS

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United States of America Patent

APP PUB NO 20150371134A1
SERIAL NO

14736231

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Abstract

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A system and method for predicting a product characteristic are provided. The system includes a data acquisition module configured to acquire raw data associated with to-be predicted prediction information, a data conversion module configured to convert the raw data into computable normalized data, and a result prediction module configured to calculate a prediction result based on the normalized data and compare the prediction result with a predetermined standard value. The result prediction module includes a neural network prediction model configured to calculate the prediction result based on the normalized data. The prediction information may include reliability and/or yield to prevent major reliability or yield problems from occurring during manufacturing of semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION18 ZHANGJIANG ROAD PUDONG NEW AREA SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIEN, WEITING Shanghai, CN 1 14
KANG, SHENG Shanghai, CN 8 103
SII, HOWKING Shanghai, CN 1 14

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