Importance

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Abstract

A light emitting module includes a semiconductor light emitting element, an optical wavelength conversion member configured to convert the wavelength of element light emitted from the semiconductor light emitting element and to emit converted light, having a color different from the element light, a transmitting member disposed between the semiconductor light emitting element and the optical wavelength conversion member and configured to allow the element light to be transmitted therethrough, the transmitting member being made of a thermal conductive material that transfers the heat generated from the optical wavelength conversion member to the outside, and a transparent adhesive bonding the optical wavelength conversion member and the transmitting member to each other, the adhesive having a thickness of 2.0 μm or less.

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First Claim