METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD, AND SHIELD FILM AND SHIELD PRINTED WIRING BOARD
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United States of America Patent
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Issued Date -
Dec 24, 2015
app pub date -
Dec 10, 2013
filing date -
Dec 20, 2012
priority date (Note) -
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Abstract
A method of manufacturing a shield printed wiring board, a shield film, and a shield printed wiring board, which make it possible to achieve cost reduction, are provided. A method of manufacturing a shield printed wiring board includes the steps of: forming a shield film which includes an insulating layer formed of resin in which polymerization has proceeded so that a resin cure degree is 90% or higher, a metal layer stacked onto the insulating layer, and an adhesive layer stacked onto the metal layer; mounting the shield film on a printed board; and thermally pressing the shield film and the printed board onto each other.
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