Semiaromatic polyamide resin composition and molded body formed by molding same
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United States of America Patent
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Jan 30, 2018
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N/A
app pub date -
Mar 19, 2014
filing date -
Mar 21, 2013
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Abstract
Disclosed is a semiaromatic polyamide resin composition including a semiaromatic polyamide (A), a phosphorus-based flame retardant (B) and an inorganic aluminum compound (C), wherein the mass ratio (A/B) between (A) and (B) is 50/50 to 95/5; the amount of the inorganic aluminum compound (C) is 0.1 to 20 parts by mass in relation to 100 parts by mass of the total amount of (A) and (B); (A) is constituted with an aromatic dicarboxylic acid component, an aliphatic diamine component and a monocarboxylic acid component; and the content of the monocarboxylic acid component is 0.3 to 4.0 mol % in relation to the whole monomer components constituting (A).
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