POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE

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United States of America Patent

APP PUB NO 20150376464A1
SERIAL NO

14767494

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Abstract

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The present invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The polishing composition has a volume average particle diameter DA of grains in the polishing composition of 20 nm to 60 nm measured by dynamic light scattering at a concentration equivalent to 0.2% abrasive content by mass.

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Patent Owner(s)

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FUJIMI INCORPORATEDKIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASADA, Maki Kiyosu-shi, JP 8 16
SUGA, Yusuke Kiyosu-shi, JP 32 67
TANSHO, Hisanori Kiyosu-shi, JP 14 41
TSUCHIYA, Kohsuke Kiyosu-shi, JP 35 88

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