PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM

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United States of America Patent

APP PUB NO 20150380123A1
SERIAL NO

14771365

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the present invention is to provide a conductive coating film formed of a copper paste on an insulating substrate which has a good conductivity and a good adhesion property to the insulating substrate. The process for producing a conductive coating film according to the present invention comprising the steps of applying a copper paste comprising copper particles, a binder resin and a solvent as main components onto an insulating substrate to form a coating film on the substrate, and then drying the coating film to obtain a copper powder-containing coating film; treating the copper powder-containing coating film with an organic acid or an organic acid salt; and subjecting the thus treated copper powder-containing coating film to heat treatment with superheated steam. According to the present invention, it is possible to obtain a conductive coating film having a good conductivity and a good adhesion property to the insulating substrate.

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Patent Owner(s)

Patent OwnerAddress
TODA KOGYO CORPHIROSHIMA-SHI HIROSHIMA 732-0828

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Chiho Otake-shi, JP 5 38
KAKIHARA, Yasuo Otake-shi, JP 11 47
YATSUKA, Takeshi Otake-shi, JP 17 259

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