PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME
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United States of America Patent
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app pub date -
Sep 9, 2015
filing date -
Dec 28, 2012
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Abstract
A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts is larger than that of each of the first conductive posts. A manufacturing method thereof is also provided.
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