THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20160005677A1
SERIAL NO

14789207

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Abstract

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A thermally conductive sheet includes a thermosetting resin and an inorganic filler material. When a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material, a pore diameter distribution curve of the inorganic filler material has a first maximum value in the range where the pore diameter R is greater than or equal to 0.1 μm and less than or equal to 5.0 μm, and a second maximum value in the range where the pore diameter R is greater than or equal to 10 μm and less than or equal to 30 μm, and the difference between a second pore diameter at the second maximum value and a first pore diameter at the first maximum value is greater than or equal to 9.9 μm and less than or equal to 25 μm.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO BAKELITE CO LTD5-8 HIGASHI-SHINAGAWA 2-CHOME SHINAGAWA-KU TOKYO 1400002 ?1400002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirasawa, Kazuya Kariya-shi, JP 13 78
Kitagawa, Kazuya Tokyo, JP 11 15
Kurokawa, Motomi Aichi-ken, JP 7 4
Mochizuki, Shunsuke Tokyo, JP 43 228
Nagahashi, Keita Tokyo, JP 8 6
Shirato, Yoji Tokyo, JP 11 34
Tsuda, Mika Tokyo, JP 10 7

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