Exposed-Heatsink Quad Flat No-Leads (QFN) Package
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United States of America Patent
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Jul 2, 2014
filing date -
Jul 2, 2014
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Abstract
Consistent with an example embodiment, there is a method for preparing an integrated circuit (IC) device having enhanced heat dissipation. The method comprises providing a heat sink array having a top-side surface and an under-side surface; the heat sink array has die placement areas on the top-side surface. A plurality of active device die are die bonded onto the die placement areas on the heat sink array. The plurality of active device die are singulated into an individual heat sink device die having a heat sink portion attached to its underside.
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