Direct Thermal Path Heat Sinking Using Fins Formed From Energy Conversion Device Components, Including Subcomponents of Vertical Multijunction Photovoltaic Receivers Used For High Intensity Beaming and Wireless Power Transmission
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United States of America Patent
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Oct 31, 2014
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Jul 3, 2014
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New high energy operating regimes for high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for power beaming and wireless power transmission are made possible by new direct thermal pathways for heat sinking, where an energy conversion device comprises a plurality of fins [1] originating from inside the energy conversion device; [2] formed from an energy conversion device component; and where those fins [3] individually support traffic in energy carriers essential to the function of the energy conversion device. This allows high energy thermal interfacing and high intensity energy conversion, such as for receiving and transducing extremely high intensity light shined onto a small surface semiconductor device such as a vertical multijunction photovoltaic receiver. This allows high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for high intensity power beaming and wireless power transmission.
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