STRUCTURE FOR BONDING METAL PARTS TO EACH OTHER AND BONDING METHOD THEREFOR

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United States of America Patent

SERIAL NO

14769999

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Abstract

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A method for bonding metal parts to each other includes a first step of sandwiching a bonding member between surfaces to be bonded of a first metal part and a second metal part, the bonding member having a melting point within a range of −150° C. to +150° C. with respect to melting points of the first and second metal parts, and a second step of resistance-welding the surfaces to be bonded of the first and second metal parts to each other using the bonding member.

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Patent Owner(s)

Patent OwnerAddress
OMRON CORPORATIONKYOTO PREFECTURE JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagasaka, Shogo Shiga, JP 6 46
Tsuchida, Makoto Kyoto, JP 14 216
Yoshida, Hitoshi Shiga, JP 171 2050
Yoshioka, Hidekazu Kyoto, JP 5 19

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