Composite Electroless Nickel Plating
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 14, 2016
app pub date -
Jul 10, 2014
filing date -
Jul 10, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative terminal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully