Composite Formulation and Electronic Component
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United States of America Patent
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Issued Date -
Jan 14, 2016
app pub date -
Jul 11, 2014
filing date -
Jul 11, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A composite formulation and electrical component are disclosed. The composite formulation includes a polymer matrix having at least 15% crystallinity and process-aid-treated copper-containing particles blended with the polymer matrix including higher aspect ratio particles and lower aspect ratio particles. The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particle and the second particles. The electrical component includes a composite product produced from the composite formulation and is selected from the group consisting of an antenna, electromagnetic interference shielding device, a connector housing, and combinations thereof.
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