Composite Formulation and Composite Product
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United States of America Patent
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Issued Date -
Jan 14, 2016
app pub date -
Jul 11, 2014
filing date -
Jul 11, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.
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