Importance

Loading Importance Indicators...

Abstract

The present invention provides to an Au—Sn—Bi alloy film which has an excellent bondability on a metalized layer formed on an LED element or a substrate as a bonding layer made of the Au—Sn—Bi alloy and is uniform and thin. In the present invention, an Au—Sn—Bi alloy thin film which has the thickness of 5 μm or less and includes at least a eutectic structure can be formed by using an Au—Sn—Bi alloy powder paste that mixes the Au—Sn alloy powder containing 20 wt % to 25 wt % of Sn, 0.1 wt % to 5.0 wt % of Bi, and a balance of Au, and having a particle diameter of 10 μm or less with an RA flux of 15 wt % to 30 wt %, screen printing the Au—Sn—Bi alloy powder paste in a predetermined region on the Au metallized layer, and subsequently, heating, melting and then solidifying the Au—Sn—Bi alloy powder.

Loading the Abstract Image...

First Claim