Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systems
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United States of America Patent
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Apr 11, 2017
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app pub date -
Jul 15, 2014
filing date -
Jul 15, 2014
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Abstract
Systems and methods for delivering liquid precursor in a substrate processing system include supplying liquid precursor using a first valve in fluid communication with a liquid precursor source; supplying purge gas using a second valve in fluid communication with a purge gas source; arranging a third valve having a first input port in fluid communication with an output port of the first valve and a second input port in fluid communication with an output port of the second valve; arranging an input port of a first divert injector valve in fluid communication with an output port of the third valve; and operating the first valve, the second valve, the third valve and the first divert injector valve in first, second, third and fourth modes.
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