Method for etching protective film, method for producing template, and template produced thereby

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United States of America Patent

PATENT NO 10248026
APP PUB NO 20160018738A1
SERIAL NO

14863693

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Abstract

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A substrate having a protective film formed on a front surface and a recess in a back surface opposite the front surface is prepared. A resist pattern is formed on the protective film. The protective film is etched using plasma while applying a bias voltage, using the resist pattern as a mask. The bias voltage is increased according to the manner of decrease in the dielectric constant of a region of the substrate corresponding to a covered region of the front surface at which the protective film is present.

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Patent Owner(s)

  • FUJIFILM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohtsu, Akihiko Shizuoka-ken, JP 43 355

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