EXPOSURE METHOD, EXPOSURE APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20160018740A1
SERIAL NO

14604818

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment, an exposure method is disclosed. The method includes irradiating a first light and a second light on a mask including a plurality of light transmitting portions arranged in a periodic pattern. The first light has a peak of intensity at a first wavelength. The second light has a peak of intensity at a second wavelength. The first wavelength is shorter than a distance between the mask and a substrate disposed to be separated from the mask. The second wavelength is longer than the first wavelength. The method includes irradiating a first interference light transmitted through the light transmitting portions and a second interference light transmitted through the light transmitting portions on the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MEMORY CORPORATIONTOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, Shinichi Yokohama, JP 374 3499
SATO, Takashi Fujisawa, JP 951 9291
SUZUKI, Ryoichi Yokohama, JP 166 1233

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