Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies

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United States of America Patent

PATENT NO 9716023
SERIAL NO

14332096

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Abstract

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A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, disposing a second adhesive over a peripheral portion of the carrier wafer, the second adhesive having a second glass transition temperature greater than the first glass transition temperature, and bonding the first adhesive to an active front side of the device wafer and the second adhesive to a peripheral portion of the front side of the device wafer. Related assemblies may be used in such methods.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bayless, Andrew M Boise, US 44 39
Bowen, Neal Kuna, US 3 11
Farrens, Sharon N Boise, US 14 565

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