Multi-layer package with integrated antenna

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United States of America Patent

PATENT NO 10128177
APP PUB NO 20160020165A1
SERIAL NO

14433369

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Abstract

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Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elsherbini, Adel A Chandler, US 256 1524
Frank, Torrey W Chandler, US 8 368
Kamgaing, Telesphor Chandler, US 273 1486

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