THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR
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United States of America Patent
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Issued Date -
Jan 21, 2016
app pub date -
Jul 21, 2014
filing date -
Jul 21, 2014
priority date (Note) -
Abandoned
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Abstract
A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate.
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