Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement
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United States of America Patent
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Oct 18, 2016
Grant Date -
Jan 21, 2016
app pub date -
Jul 18, 2014
filing date -
Jul 18, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.
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