SPUTTERING APPARATUS
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United States of America Patent
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N/A
Issued Date -
Jan 28, 2016
app pub date -
Jul 7, 2015
filing date -
Jul 24, 2014
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sputtering apparatus that forms a film on a substrate by sputtering in a chamber includes an electrode including a holding portion that holds a target, and configured to apply a potential to the target via the holding portion, a first magnet and second magnet arranged to sandwich a space between the holding portion, and a substrate arrangement surface on which the substrate should be arranged, and to be spaced apart from each other in a direction along the substrate arrangement surface, a shield arranged between the first magnet and the second magnet, and between the substrate arrangement surface and the holding portion, and a rotation driving unit configured to integrally rotate the target, the first magnet, and the second magnet.
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