Electrical connector between die pad and z-interconnect for stacked die assemblies
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United States of America Patent
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Nov 29, 2016
Grant Date -
Jan 28, 2016
app pub date -
Sep 30, 2015
filing date -
May 20, 2008
priority date (Note) -
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Abstract
Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.
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